Adhesives for Electronics Applications
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3T Frontiers supplies EPOXY and UV CURE adhesives which are widely used in the Electrical and Electronics industries. Hot selling products include Underfill resin for BGA/CSP/WLP, adhesives for Finger Print Module, thermal & UV cure adhesives for Camera Module, OCR, adhesives for speaker module etc... Applications :1) Underfill Adhesives 2) Adhesives for Camera Module 3) Adhesive for Speaker Module 4) Adhesive for Fingerprint Module 5) Glob-Top Encapsulants 6) Adhesives for LED BLU 7) Dust Adhesives 8) Optical Clear Resin 9) UV + Thermal hubrid Adhesives 10) Two pack epoxy Adhesives |
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Underfill Adhesives
Underfill
Adhesives
Underfill
is thermoset expoxy adhesives between semiconductor packages (CSP, BGA,
WLP) and PCB to reduce physical and chemical impact. It is located
between the package and FR-4 board. Underfill distributes the stress
caused by the difference of thermal expansion coefficient between chip
and substrate, thereby improving reliability of parts.
Applications: Automobile
module, Fingerprint module, Wearable devices
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- Fast Dure, Excellent adhesion - Good toughness, Good water absorption - Applications : Home appliances, Mobile devices, Wearable devices, Automobile module |
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- Fast Cure, Long Pot Life - Excellent drop impact, Excellent Reworkability - Applications : Home appliances, Mobile devices, Wearable devices |
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- Fast cure, Low viscosity, High
Tg - Excellent thermal shock reliability - Applications : Home appliances, Mobile devices, Wearable devices, Automobile module |
Series
Comparison of Main Characteristics |
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| Model |
Apperance |
Viscosity (cps) |
Tg (°C) by DSC |
CTE (ppm/°C) |
Cure Condiction |
Pot Life (day) |
|
| α1 1) |
α2 2) |
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| WE-1007N |
Light Yellow |
2,500 |
90 |
60 |
220 |
135°C @20min |
7 |
| WE-1007NB |
Black |
2,500 |
90 |
60 |
220 |
135°C @20min | 7 |
| WE-3008S1 |
Light Yellow |
2,800 |
7 |
46 |
225 |
135°C @10min | 20 |
| WE-3008B1 |
Black |
2,800 |
7 |
46 |
225 |
135°C @10min | 20 |
| WE-3008SN |
Black |
2,500 |
8 |
45 |
235 |
135°C @10min | 20 |
| WE-3009S |
Black |
2,100 |
16 |
45 |
255 |
135°C @10min | 20 |
| WE-3010A1 |
Black |
1,700 |
35 |
50 |
250 |
80°C @20min | 3 |
| WE-3010A2 |
Black |
2,000 |
35 |
60 |
220 |
80°C @20min | 3 |
| WE-7345L |
Black |
600 |
95 |
60 |
200 |
135°C @10min | 3 |
| WE-7345M |
Black |
1,500 |
95 |
60 |
200 |
135°C @10min | 3 |
| WE-7345FC |
Black |
2,500 |
100 |
40 |
160 |
135°C @10min | 2 |
Remarks: 1) α1 : Below Tg ; 2) α2 : Above Tg
Low Temperature Cure Adhesives
| Low
Temperature Cure Adhesives can be cured over 60°C ~ 80°C. This is especially useful for applying over plastics as well as over glass and metals. |
| Product Features - Resin-Bleed issues can be resolved - Low CTE - Excellent Thermal Shock Reliability |
| Applications: |
|---|
| - Camera
module, Fingerprint module, Speaker module, Glob-top encapsulants, LED
BLU |
| Model |
Appearance |
Viscosity
(cps) |
Ti |
Tg
(C) by DSC |
CTE |
Cure
Condition |
Pot
Life (day) |
Applications |
|
| α1 1) | α2 2) | ||||||||
| WE-4340A6 |
Black |
25,000 |
3.5 |
35 |
60 |
185 |
60°C @40min |
3 |
Camera Module |
| WE-4321A8 |
Black |
14,000 |
5.0 |
35 |
50 |
190 |
60°C @40min | 3 |
|
| WE-4452 |
Black |
21,000 |
3.0 |
40 |
45 |
185 |
70°C @30min | 3 |
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| WE-4320A |
Black |
10,000 |
3.5 |
30 |
50 |
190 |
70°C @30min | 3 |
|
| WE-4150 |
Black |
25,000 |
3.5 |
35 |
45 |
185 |
80°C @30min | 3 |
|
| WE-4115K |
Black |
7,000 |
3.0 |
35 |
50 |
185 |
80°C @30min | 3 |
|
| WE-4432W |
White |
20,000 |
4.5 |
40 |
45 |
185 |
80°C @20min | 3 |
LED BLU |
| WE-4430B |
Black |
20,000 |
4.5 |
40 |
45 |
185 |
80°C @20min | 3 |
|
| WE-2120 |
Dark Blue |
10,000 |
3.0 |
23 |
46 |
220 |
135°C @10min | 10 |
Glob-Top Encapsulants |
| WE-2120W |
Milky White |
10,000 |
3.0 |
23 |
46 |
220 |
135°C @10min | 10 |
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| WE-2120WP |
White (Fluroscent) |
10,000 |
3.0 |
23 |
46 |
220 |
135°C @10min | 10 |
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| WE-3009A |
Light Yellow |
2,200 |
1.0 |
15 |
58 |
210 |
135°C @20min | 7 |
Fingerprint Scan |
| WE-3009G |
Light Yellow |
2,500 |
1.0 |
13 |
60 |
220 |
135°C @20min | 7 |
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| WE-3009GL |
Light Yellow |
2,000 |
1.0 |
13 |
60 |
220 |
135°C @10min | 7 |
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| Remarks: 1) α1 : Below Tg ; 2) α2 : Above Tg | |||||||||
Applications:
 Adhesives for Camera Module It has strong adhesion and excellent storage stability. In addition, we have various know-how about Resin-Bleed which is an issue in VCM market |
 Adhesives for Fingerprint Module It has excellent thermal property and can be used to solve the problem of voids caused by out-gassing when applied to the products |
 Glob-Top Encapsulants It has excellent adhesion thereby enables it to prevent chip crack and falling out of the board due to drop impact and external environment (temperature, humidity) |
 Ahesives for LED BLU LED-BLU application is widely used to enhance sharp image quality and dimensional feeling. Our thermosetting adhesive provides excellent reliability |
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