Anisotropic Conductive Film for PCB - FOB/FOF (FPC,TCP,COF/PCB)
- High adhesion for COF & FPC
- Good contact resitance for reliability
- Good for wide bonding temperature range
Series | TGP20500 | TGP5000 | EMA8888 | |||
---|---|---|---|---|---|---|
Spec. | Pitch Size | Line | um/um² | 40(2.5um ball),50(3.5um ball) | ||
Space | um | 40(2.5um ball),50(3.5um ball) | ||||
Thickness | um | 35,45 (customer options) | ||||
Length | m | 50,100,200,400 (customer option) | ||||
Width | mm | 1.2, 1.5, 2.0, 2.5 ~ (customer option) | ||||
Conductive Particle | Type | -- | Ni | |||
Size | um | 5 | 5 | 3 | ||
Density | pcs/mm² | 1,500 | 10,000 | |||
separator Film | um | 50/75 | ||||
Pre-bonding Condition | Temp | °C | 80±10 | 60±10 | 70±10 | |
Time | sec | 1~3 | 0.5~3 | 1~2 | ||
Pressure | MPa | ≥1 | ≥0.5 | 1~2 | ||
Main bonding Condition | Temp | °C | 180~200 | 140~200 | 130~190 | |
Time | sec | ≥8 | ≥4 | ≥4 | ||
Pressure | MPa | 3~4 | 2~5 | 2~5 | ||
Properties | Connection Resistance | Ω | <1 | <2 | ||
Insulation Resistance | Ω | >10⁹ | ||||
Peel Strength | gf/cm | >700 | >500 | |||
Repairability | -- | Use Acetone,MEK and general repair solution |
Anisotropic Conductive Film for OLB (LCD/OLED/Hyper-Dist)
- Fine pitch interconnect : 20um fine pitch for TFT-LCD, color STN,EL
- High adhesion, high reliability, void-free bonding, and repairable by common solvents
- Low bonding temperature and quick bonding time
Series | TSC5330/40 | TSC4330 | EMA7870 | |||
---|---|---|---|---|---|---|
Spec. | Pitch Size | Line | um/um² | 6 | 8 | 10 |
Space | um | 14 | 4 | 10 | ||
Thickness | um | 16,18,25 (customer option) | ||||
Length | m | 50,100,200 (customer options) | ||||
Width | mm | ≥1.0 ~ (customer options) | ||||
Conductive Particle | Type | -- | Au/Ni/polymer or Ni/polymer | |||
Size | um | 3/4 | 3 | 3 | ||
Density | pcs/mm² | 5,500/7,000 | 15,000 | 6,000 | ||
separator Film | um | 50 | ||||
Pre-bonding Condition | Temp | °C | 50~70 | |||
Time | sec | 1~3 | ||||
Pressure | MPa | 1 | ||||
Main bonding Condition | Temp | °C | 150±20 | 180±20 | 170±20 | |
Time | sec | ≥4 | ≥4 | ≥4 | ||
Pressure | MPa | 3~5 | 3~5 | 3~5 | ||
Properties | Connection Resistance | Ω | <1 | |||
Insulation Resistance | Ω | >10⁹ | ||||
Peel Strength | gf/cm | >700 | ||||
Repairability | -- | Use Acetone,MEK and general repair solution |
Anisotropic Conductive Film for FOG (LCD/OLED)
- Fine pitch interconnection: 50um pitch for TFT-LCD, color STN, EL
- High adhesion, high reliability, void-free bonding, and repairable by common solvents
- Applicable for fine pitch OLB with shorter bonding time
Small-Medium Size LCD Panels | Large Size LCD Panels | ||||||||
---|---|---|---|---|---|---|---|---|---|
Series | TSB21000 | TSC22000 | TSC5340 | TSC5330/40 | TSC4330 | EMA7870 | |||
Spec. | Pitch Size | Line | um/um² | 50 | 25 | 25 | 6 | 8 | 10 |
Space | um | 50 | 25 | 25 | 14 | 4 | 10 | ||
Thickness | um | 16, 18, 25 (customer option) | |||||||
Length | m | 50,100, 200 (customer option) | |||||||
Width | mm | 0.8 ~ (customer option) | |||||||
Conductive Particle | Type | -- | Au/Ni/polymer | Ni/polymer | Au/Ni/polymer or Ni/polymer | ||||
Size | um | 10 | 4/5 | 4/5 | 3/4 | 3 | 3 | ||
Density | pcs/mm² | 800 | 5,000/4,500 | 7,000/6,000 | 5,500/7,000 | 15,000 | 6,000 | ||
separator Film | um | 50 | |||||||
Pre-bonding Condition | Temp | °C | 60~80 | 50~70 | |||||
Time | sec | 1~3 | |||||||
Pressure | MPa | 1 | |||||||
Main bonding Condition | Temp | °C | 190±10 | 195±15 | 160±20 | 150±20 | 180±20 | 170±20 | |
Time | sec | ≥8 | ≥7 | ≥5 | ≥4 | ≥4 | ≥4 | ||
Pressure | MPa | 1.5~2 | 2~3 | 3~5 | |||||
Properties | Connection Resistance | Ω | <1 | ||||||
Insulation Resistance | Ω | >10⁹ | |||||||
Peel Strength | gf/cm | >700 | |||||||
Repairability | -- | Use Acetone,MEK and general repair solution |
OLED | |||||||||
---|---|---|---|---|---|---|---|---|---|
Series | TSC22000 | TSC53000 | |||||||
Spec. | Pitch Size | Line | um/um² | 25 | 8,000um² | ||||
Space | um | 25 | 11 | ||||||
Thickness | um | 18, 25 (customer option) | |||||||
Length | m | 50, 100, 200 (customer option) | |||||||
Width | mm | 1.0 ~ | 0.8 ~ | ||||||
Conductive Particle | Type | -- | Ni/polymer or Ni | ||||||
Size | um | 5 | 4+3/5+3 | ||||||
Density | pcs/mm² | 4,500 | 7,000 | ||||||
separator Film | um | 50 | |||||||
Pre-bonding Condition | Temp | °C | 70~90 | 60~80 | |||||
Time | sec | 1~3 | 1~2 | ||||||
Pressure | MPa | 1 | 1~2 | ||||||
Main bonding Condition | Temp | °C | 190±10 | 160±20 | |||||
Time | sec | ≥8 | ≥4 | ||||||
Pressure | MPa | 2.5~3 | 2~4 | ||||||
Properties | Connection Resistance | Ω | <1 | ||||||
Insulation Resistance | Ω | >10⁹ | |||||||
Peel Strength | gf/cm | >700 | >800 | ||||||
Repairability | -- | Use Acetone,MEK and general repair solution |
Anisotropic Conductive Film for COG (Glass/Film/Hyper-Dist)
- Fine pitch interconnection : min. 4.5um gap for COG application
- Minimum connecting area of bump: 500um2
- High reliability and adhesion, capture rate property
Series | TCG9031 | |||
---|---|---|---|---|
Spec. | Pitch Size | Line | um/um² | 800um² |
Space | um | 6 | ||
Thickness | um | 18 (customer options) | ||
Length | m | 50,100(customer options) | ||
Width | mm | 1.5~3.5 (customer options) | ||
Conductive Particle | Type | -- | Au/Ni/polymer or Ni/polymer | |
Size | um | 3 | ||
Density | pcs/mm² | 65,000 | ||
separator Film | um | 50 | ||
Pre-bonding Condition | Temp | °C | 80 | |
Time | sec | 1~2 | ||
Pressure | MPa | 1~2 (per unit area of ACF) | ||
Main bonding Condition | Temp | °C | 150±20 | |
Time | sec | ≥5 | ||
Pressure | MPa | 40~100(per bump area of IC) | ||
Properties | Connection Resistance | Ω | <1 | |
Insulation Resistance | Ω | >10⁹ | ||
Peel Strength | gf/cm | -- | ||
Repairability | -- | Use Acetone,MEK and general repair solution |
Anisotropic Conductive Film for COP
- Fine pitch interconnection : min. 6um gap for COP application
- Minimum connecting area of bump: 600um2
- Shorting bonding time
Anisotropic Conductive Film for Camera Module
- Low bonding Temperature
- Short bonding time
Series | TSB2000 | TCM5000 | |||
---|---|---|---|---|---|
Spec. | Pitch Size | Line | um/um² | 75(10um ball),125(20um ball) | |
Space | um | 75(10um ball),125(20um ball) | |||
Thickness | um | 25,35,45 (customer options) | |||
Length | m | 50,100(customer options) | |||
Width | mm | 1.5~10 (customer options) | |||
Conductive Particle | Type | -- | Au/Ni/polymer | ||
Size | um | 10/20 | |||
Density | pcs/mm² | 1,200/250,450 | |||
separator Film | um | 50 | |||
Pre-bonding Condition | Temp | °C | 80±10 | 70±10 | |
Time | sec | 1~3 | |||
Pressure | MPa | ≥1 | 1~3 | ||
Main bonding Condition | Temp | °C | 190±10 | 155±25 | |
Time | sec | ≥7 | ≥6 | ||
Pressure | MPa | 1.5~2.0 | |||
Properties | Connection Resistance | Ω | <1 | ||
Insulation Resistance | Ω | >10⁹ | |||
Peel Strength | gf/cm | >800 | |||
Repairability | -- | Use Acetone,MEK and general repair solution |
Anisotropic Conductive Film for Touch (Glass/ Film)
- Low bonding Temperature
- Short bonding time
Touch Panel- Film Type | Touch Panel- Glass Type | |||||||||
---|---|---|---|---|---|---|---|---|---|---|
Series | TGP20520 | TOU2050 | TCH8000 | TOU5000 | TOU3000 | TOU8000 | TOU5010 | |||
Spec. | Pitch Size | Line | um/um² | 75(10um ball),200(20um ball) | 25(5um ball),75(10um ball),200(20um ball) | |||||
Space | um | >25/35 | 18/25/35 | |||||||
Thickness | um | 25/35 | 18/25/35 | |||||||
Length | m | 50,100, 200 (customer option) | ||||||||
Width | mm | 1.5~3.0 (customer option) | ||||||||
Conductive Particle | Type | -- | Au/Ni/polymer | |||||||
Size | um | 20 | 10 | 10/20 | 20 | 5/10/20 | ||||
Density | pcs/mm² | 200 | 800 | 800/200 | 200 | 4,500/800/200 | ||||
separator Film | um | 50 | ||||||||
Pre-bonding Condition | Temp | °C | 80±10 | 65±15 | 70±10 | |||||
Time | sec | 1~3 | ||||||||
Pressure | MPa | ≥1 | ||||||||
Main bonding Condition | Temp | °C | 155±5 | 135~160 | 150±10 | 170~190 | 190±20 | 150±20 | ||
Time | sec | 10~15 | 10~17 | ≥5 | 8~13 | 10~15 | ≥5 | |||
Pressure | MPa | <1 | ||||||||
Properties | Connection Resistance | Ω | <5 | <1 | <5 | <1 | <3 | |||
Insulation Resistance | Ω | >10⁹ | ||||||||
Peel Strength | gf/cm | >500 | >700 | >500 | >700 | |||||
Repairability | -- | Use Acetone,MEK and general repair solution |
Anisotropic Conductive Film for COF & COB & Flipchip
COF | COB/ Flipchip | ||||||||
---|---|---|---|---|---|---|---|---|---|
Series | TCF7040/41 | TFA22000 | |||||||
Spec. | Pitch Size | Line | um/um² | 1,500um² | 1,500um² | ||||
Space | um | 15 | 15 | ||||||
Thickness | um | 30 (customer option) | |||||||
Length | m | 50, 100 (customer option) | |||||||
Width | mm | 1.0 ~ (customer option) | |||||||
Conductive Particle | Type | -- | Au/Ni/polymer | ||||||
Size | um | 4 | 3/5 | ||||||
Density | pcs/mm² | 40,000 | 40,000/4,500 | ||||||
separator Film | um | 50 | |||||||
Pre-bonding Condition | Temp | °C | 80 | ||||||
Time | sec | 1~3 | |||||||
Pressure | MPa | 1~2 (per unit area of ACF) | |||||||
Main bonding Condition | Temp | °C | 190±10 | 180±10 | |||||
Time | sec | 5~10 | ≥15 | ||||||
Pressure | MPa | 40~100 per bump area of IC) | |||||||
Properties | Connection Resistance | Ω | <1 | ||||||
Insulation Resistance | Ω | >10⁹ | |||||||
Peel Strength | gf/cm | >700 | |||||||
Repairability | -- | Use Acetone,MEK and general repair solution |
Anisotropic Conductive Film for Fingerprint Module
- Low bonding Temperature
- Short bonding time
Series | TGP5010 | TSB20522F | TCM5022 | ||||||
---|---|---|---|---|---|---|---|---|---|
Spec. | Pitch Size | Line | um/um² | 75 | 125 | 125 | |||
Space | um | 75 | 125 | 125 | |||||
Thickness | um | 25,35,45 (customer options) | |||||||
Length | m | 50,100 (customer options) | |||||||
Width | mm | 1.5 ~ 10 (customer options) | |||||||
Conductive Particle | Type | -- | Au/Ni/polymer | Au/Ni/polymer+metal | |||||
Size | um | 10 | 20+8 | ||||||
Density | pcs/mm² | 800 | 200 & 500 | 200 &350 | |||||
separator Film | um | 50 | |||||||
Pre-bonding Condition | Temp | °C | 70±10 | 80±10 | 70±10 | ||||
Time | sec | 1~3 | |||||||
Pressure | MPa | 1~2 | 1~3 | ||||||
Main bonding Condition | Temp | °C | 140~200 | 180~200 | 130~180 | ||||
Time | sec | ≥4 | ≥7 | ≥6 | |||||
Pressure | MPa | 1.5~2.5 | 1.5~2.5 | 1~3 | |||||
Properties | Connection Resistance | Ω | <1 | ||||||
Insulation Resistance | Ω | >10⁹ | |||||||
Peel Strength | gf/cm | >700 | |||||||
Repairability | -- | Use Acetone,MEK and general repair solution |
FAQ for ACF (Anisotropic Conductive Film)
In the technology of making conductive particles, the only metal that can be coated on the plastic bead is Cu / Ni.
- Click to view Applications:
- Printed Circuit Board (PCB)
- Outer Lead Bondings (OLB)
- FOG (LCD/OLED)
- COG (Glass/Film/Hyper-Dist
- COP
- Camera Module (CM)
- Touch Panel (Glass/Film)
- COF
- Fingerprint Module
- Main Products
- ACF Film
- ACF Bonders
- TV Panel Repair ACF Bonding M/C
- ND-LCD Filters
- Prescale – Pressure Measurement
- Thermoscale – Temperature Measurement
- Adhesives