ACF Product Lineup (Customizable)

Anisotropic Conductive Film for PCB

- High adhesion for COF & FPC
- Good contact resitance for reliability
- Good for wide bonding temperature range

Anisotropic Conductive Film for OLB (LCD/OLED/Hyper-Dist)

- Fine pitch interconnect : 20um fine pitch for TFT-LCD, color STN,EL
- High adhesion, high reliability, void-free bonding, and repairable by common solvents
- Low bonding temperature and quick bonding time

Anisotropic Conductive Film for FOG (LCD/OLED)

- Fine pitch interconnection: 50um pitch for TFT-LCD, color STN, EL
- High adhesion, high reliability, void-free bonding, and repairable by common solvents
- Applicable for fine pitch OLB with shorter bonding time

Anisotropic Conductive Film for COG (Glass/Film/Hyper-Dist)

- Fine pitch interconnection : min. 4.5um gap for COG application
- Minimum connecting area of bump: 500um2
- High reliability and adhesion, capture rate property

Anisotropic Conductive Film for COP

- Fine pitch interconnection : min. 6um gap for COP application
- Minimum connecting area of bump: 600um2
- Shorting bonding time

Anisotropic Conductive Film for Camera Module

- Low bonding Temperature
- Short bonding time

Anisotropic Conductive Film for Touch (Glass/Film)

- high Adhesion to plastic and Glass substrate
- Good contact resistance for reliability
- Good corrosion resistance

Anisotropic Conductive Film for COF

- Fine pitch connections : min 15um gap for COF
- High reliability and stable property on 2 layer PI film

Anisotropic Conductive Film for Fingerprint

- Low bonding temperature
- Good water resistance

ACF Products Overview

Series Conductive Particle Pitch Size Bonding Conditions
Type Size (um) Density (/mm2) Line (um2) Space (um) Temp (°C) Time (sec) Pressure (MPa)
ACF for PCB
PCB1 Ni 3 10,000 60,000 50 130~190 4 2.0~5.0
PCB2 Ni 5 10,000 30,000 20 130~200 4 2.0~5.0
PCB3 Ni 5 10,000 40,000 50 140~200 4 2.0~5.0
OLB
OLB-1 Ni/polymer 3 14,500 4,000 4 150~200 4 3.0~5.0
OLB-2 Ni/polymer 4 5,000 7,000 7 130~190 4 3~5
OLB-3 Ni/polymer 4 5,000 7,000 7 140~190 4 3~5
OLB-HED Ni/polymer 3 8,000 1,500 4 150~190 4 3~6
FOG
FOG-1 Ni/Au-polymer 10 800 50,000 50 180~200 8 2~4
FOG-2 Ni-polymer 5 6,000 13,000 12 140~180 5 2~4
FOG-3 Ni-polymer 4 6,000 13,000 12 140~180 5 2~4
COG
COG-8031 Ni/Au polymer 3.25 60,000 800 6 130~170 5 50~90
COG-8032 Ni/Au polymer 3.25 24,000 500 4.5 130~170 5 50~90
COP
TCP-9032 Ni polymer 3.25 20,000 600 6 140~180 5
Camera Module
CM-1 Ni/Au-polymer 20 350 90,000 80 120~180 6 0.2~0.3
CM-2 Ni/Au-polymer 10 1,200 50,000 75 180~200 7 1~3
Fingerprint
FPM-1 Ni/polymer 8 820 25,000 20 140~160 5 2~4
FPM-2 Au/Ni/polymer 30 200 80,000 150 130~190 4 1~3