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Adhesives for Electronics Applications

3T Frontiers supplies EPOXY and UV CURE adhesives which are widely used in the Electrical and Electronics industries.


Hot selling products include Underfill resin for BGA/CSP/WLP, adhesives for Finger Print Module, thermal & UV cure adhesives for Camera Module, OCR, adhesives for speaker module etc...

Applications :
1) Underfill Adhesives
2) Adhesives for Camera Module
3) Adhesive for Speaker Module
4) Adhesive for Fingerprint Module
5) Glob-Top Encapsulants
6) Adhesives for LED BLU
7) Dust Adhesives
8) Optical Clear Resin
9) UV + Thermal hubrid Adhesives
10) Two pack epoxy Adhesives

Epoxy Adhesives

Underfill Adhesives


Underfill Adhesives
Underfill is thermoset expoxy adhesives between semiconductor packages (CSP, BGA, WLP) and PCB to reduce physical and chemical impact. It is located between the package and FR-4 board. Underfill distributes the stress caused by the difference of thermal expansion coefficient between chip and substrate, thereby improving reliability of parts.

Applications: Automobile module, Fingerprint module, Wearable devices


Fast Cure, Excellent Adhesion Underfill - Fast Dure, Excellent adhesion

- Good toughness, Good water absorption

- Applications : Home appliances, Mobile devices, Wearable devices, Automobile module


Fast Cure, Long pot life
- Fast Cure, Long Pot Life

- Excellent drop impact, Excellent Reworkability

- Applications : Home appliances, Mobile devices, Wearable devices


Excellent Thermal Shock Capability
- Fast cure, Low viscosity, High Tg

- Excellent thermal shock reliability

- Applications : Home appliances, Mobile devices, Wearable devices, Automobile module
Series Comparison of Main Characteristics

Series Comparison of Main Characteristics


Model
Apperance
Viscosity (cps)
Tg (C) by DSC
CTE (ppm/C)
Cure Condiction
Pot Life
(day)
α1  1)
α2  2)
WE-1007N
Light Yellow
2,500
90
60
220
135C @20min
7
WE-1007NB
Black
2,500
90
60
220
135C @20min 7
WE-3008S1
Light Yellow
2,800
7
46
225
135C @10min 20
WE-3008B1
Black
2,800
7
46
225
135C @10min 20
WE-3008SN
Black
2,500
8
45
235
135C @10min 20
WE-3009S
Black
2,100
16
45
255
135C @10min 20
WE-3010A1
Black
1,700
35
50
250
80C @20min 3
WE-3010A2
Black
2,000
35
60
220
80C @20min 3
WE-7345L
Black
600
95
60
200
135C @10min 3
WE-7345M
Black
1,500
95
60
200
135C @10min 3
WE-7345FC
Black
2,500
100
40
160
135C @10min 2

Remarks: 1) α1 : Below Tg ; 2) α2 : Above Tg

Low Temperature Cure Adhesives


Low Temperature Cure Adhesives can be cured over 60C ~ 80C.
This is especially useful for applying over plastics as well as over glass and metals.

Product Features

- Resin-Bleed issues can be resolved
- Low CTE
- Excellent Thermal Shock Reliability

Applications:
- Camera module, Fingerprint module, Speaker module, Glob-top encapsulants, LED BLU


Model
Appearance
Viscosity (cps)
Ti
Tg (C) by DSC
CTE
Cure Condition
Pot Life (day)
Applications
α1  1) α2  2)
WE-4340A6
Black
25,000
3.5
35
60
185
60C @40min
3
Camera
Module
WE-4321A8
Black
14,000
5.0
35
50
190
60C @40min 3
WE-4452
Black
21,000
3.0
40
45
185
70C @30min 3
WE-4320A
Black
10,000
3.5
30
50
190
70C @30min 3
WE-4150
Black
25,000
3.5
35
45
185
80C @30min 3
WE-4115K
Black
7,000
3.0
35
50
185
80C @30min 3
WE-4432W
White
20,000
4.5
40
45
185
80C @20min 3
LED BLU
WE-4430B
Black
20,000
4.5
40
45
185
80C @20min 3
WE-2120
Dark Blue
10,000
3.0
23
46
220
135C @10min 10
Glob-Top
Encapsulants
WE-2120W
Milky White
10,000
3.0
23
46
220
135C @10min 10
WE-2120WP
White (Fluroscent)
10,000
3.0
23
46
220
135C @10min 10
WE-3009A
Light Yellow
2,200
1.0
15
58
210
135C @20min 7
Fingerprint
Scan
WE-3009G
Light Yellow
2,500
1.0
13
60
220
135C @20min 7
WE-3009GL
Light Yellow
2,000
1.0
13
60
220
135C @10min 7
Remarks: 1) α1 : Below Tg ; 2) α2 : Above Tg


Applications:

adhesive for camera module
Adhesives for Camera Module
It has strong adhesion and excellent storage stability. In addition, we have various know-how about Resin-Bleed which is an issue in VCM market

adhesive for fingerprint module
Adhesives for Fingerprint Module
It has excellent thermal property and can be used to solve the problem of voids caused by out-gassing when applied to the products

adhesive for glob-top encapsulant
Glob-Top Encapsulants
It has excellent adhesion thereby enables it to prevent chip crack and falling out of the board due to drop impact and external environment (temperature, humidity)

adhesive for LED BLU
Ahesives for LED BLU

LED-BLU application is widely used to enhance sharp image quality and dimensional feeling. Our thermosetting adhesive provides excellent reliability



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