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ACF Tape, ACF Film  & Applications

ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.

Adhesives
The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG), FOB, or any other configurations. It is specific to the application for which it is designed for.

ACF Conductive Particles
Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5m to 30m in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.
ACF

ACF SPECIFICATIONS - FOG (FPC, TCP, COF/Glass) for LCD & OLED Panels



Unit
FOG (FPC, TCP, COF/Glass)
Small-Medium LCD Panel
Large LCD Panel (OLB)
OLED
TSB22000 Series
TSC5340/50 Series
TSC5330/40 Series
TSC4330 Series
EMA7870 Series
TSC22000 Series
TSC5300 Series
Feature


H/Temp cure
Fast cure





Spec.
Pitch
Line
um(um2)
25
25
6
8
10
25
8,000
Space
um
25
25
14
4
10
25
11
Thickness (Option)
um
16, 18, 25
16, 18, 25
18, 25
25
Length (Option)
m
50, 100, 200
50, 100, 200
50, 100, 200
Width (Option)
mm
0.8~
1.0~
1.0~
0.8~
Conductive Particle
Type

Au/Ni/Polymer
Ni/Polymer
Au/Ni/Polymer or Ni/polymer
Ni/polymer or Ni
Ni/Polymer or Ni
Size
um
4/5
4/5
3/4
3
3
5
4+3/5+3
Density
pcs/mm2
5000/4500
7000/6000
5500/7000
15,000
6,000
4,500
7,000

Separator film
um
50
50
50
Pre-bonding Condition Temp C
60~80
50~70
8010
60~80
Time sec
1~3
1~3
1~3
1~2
Pressure MPa
1
1
1
1~2










Main bonding Condition
Temp C
19515
16020
18520
15020 18020 17020 19020 16020
Time sec
>7
>5
>4
>8
>4
Pressure
MPa
2~3
3~5
2.5~3
2~4
Properties
Connection resistance
Ohm
<1
<1
<1

Insulation resistance
Ohm
>109
>109 >109 >109
Peel strength
gf/cm
>700
>700
>700
>800
Repair Ability

Using acetone, MEK and general repair solution


ACF SPECIFICATIONS - FOB / FOF for PCB, Camera Module & Fingerprint Recognition Module



Unit
FOB/ FOF (FPC, TCP, COF/PCB)
FOB/ FOF[FPC, TCP, COF/PCB]
PCB
Camera Module
Fingerprint recognition module
TGP20500 Series
TGP5000 Series
EMA8888 Series
TSB2000 Series
TCM5000 Series
TGP5010 Series
TSB20522 Series
TCM5022 Series
Feature





High Temp cure
Low Temp cure
Standard
Standard fast cure
Low temp fast cure
Spec.
Pitch
Line
um(um2)
2.5um ball (40)/ 3.5um(50)
10um ball(75), 20um(125)
75
125
125
Space
um
2.5um ball (40)/ 3.5um(50) 4
10
75
125
125
Thickness (Option)
um
35, 45

16, 18, 25
25
25,35,45
25,35,45
Length (Option)
m
50, 100, 200, 400
50, 100, 200
50, 100
Width (Option)
mm
1.5~2.5


1.5~10.0
Conductive Particle
Type

Ni

Au/Ni/Polymer or Ni/polymer
Au/Ni/ polymer
Ni/Polymer +metal
Size
um
2.5/5
5
3
3
3
10
20+8
Density
pcs/mm2
5000/1,500
10,000
15,000
6,000
800
200&500
200&350

Separator film
um
50/75


50
Pre-bonding Condition Temp C
8010 6010 7010

7010
8010 7010
Time sec
1~3
0.5~3 1~2


1~3
1~3
Pressure MPa
>1
>0.5
1~2


1
1~3











Main bonding Condition
Temp C
19010
17030
16030 18020 17020 140~200 180~200 130~180
Time sec
>8
>4
>4


>4
>7
>6
Pressure
MPa
3~4
2~5 2~5


1.5~2.5
1.5~2.5
1~3
Properties
Connection resistance
Ohm
<1
<2


<1
Insulation resistance
Ohm
>109
>109

>109 >109
Peel strength
gf/cm
>700
>500


>700
>800
Repair Ability

Using acetone, MEK and general repair solution



ACF SPECIFICATIONS - COG / COB / Flip Chip



Unit
COG

COF

COB
Flip chip
TCG1031 Series
TCG9031 Series
TCF7040/41
Series
TFA22000 Series
Feature


H/Temp cure
Low temp cure
Standard fast cure
High temp cure
Spec.
Pitch
Line
um(um2)
800um2 800um2 1500um2 1500um2
Space
um
7
6
15
15
Thickness (Option)
um
20
18
30
30
Length (Option)
m
50, 100
50, 100
Width (Option)
mm
1.5~3.5
1.0~3.0
Conductive Particle
Type

Au/Ni/Polymer or Ni/polymer

Au/Ni/Polymer
Size
um
3
4
3/5
Density
pcs/mm2
55,000
65,000
40,000
40,000/4,500

Separator film
um
50
50
Pre-bonding Condition Temp C
60~80
80
Time sec
1~3
1~3
Pressure MPa
1-2 (per unit area of ACF)







Main bonding Condition
Temp C
21020
15020
19010 18010
Time sec
>5
5~10
>15
Pressure
MPa
40~100 (per bump area of IC)
Properties
Connection resistance
Ohm
<1
Insulation resistance
Ohm
>109
Peel strength
gf/cm
--
>700
Repair Ability

Using acetone, MEK and general repair solution






Unit
Touch Panel
Film Type
Glass Type
TCG1031 Series
TCG9031 Series
TCF7040/41
Series
TFA22000 Series
TOU3000 Series
TOU8000 Series
TOU5010 Series
Feature


Standard
Low temp Fast cure
High Temp cure
Low Temp fast cure
Spec.
Pitch
Line
um(um2)
10um ball(75), 20um(200)
5um ball(25), 10um(75), 20um(200)
Space
um
10um ball(75), 20um(200) 5um ball(25), 10um(75), 20um(200)
Thickness (Option)
um
25/35
18/25/35
Length (Option)
m
50, 100, 200
Width (Option)
mm
1.5~3.0
Conductive Particle
Type

Au/Ni/Polymer
Size
um
20
10
10/20
20
5/10/20
Density
pcs/mm2
200
800
800/200
200
4,500/800/200

Separator film
um
50
Pre-bonding Condition Temp C
8010
6515 7010
Time sec
1~3
Pressure MPa
>1










Main bonding Condition
Temp C
1555
135~160 15010 170~190
19020 15020
Time sec
10~15
10~17
>5
8~13
10~15
>5
Pressure
MPa
<1
Properties
Connection resistance
Ohm
<5
<1
<5
<1
<1
<3
Insulation resistance
Ohm
>109
Peel strength
gf/cm
>500
>700
>500
>700
Repair Ability

Using acetone, MEK and general repair solution


For Detail ACF Tape specifications and price list, kindly 
Contact us

 

ACF Tape Packaging & Reliability

- Core size : 18.5mm , 25.4mm
- Reel Size (Diameter) : 50M = Dia.96mm, 100M=Dia.126mm,  200M=Dia.195mm
- Width : 1.0, 1.2, 1.5, 2.0, 2.5, 3.0, 3.5 ...

- Storage condition: -5C ~ 5C sealed with moisture absorber

- Shelf Life
        Packed : 6 month at -5C ~ 5C
        Unpacked : 3 weeks under 25C, 75%RH
        After Pre-bonding: 72hr under 25C, 75%RH

All Products passed passed through a series of stringent Reliability testings.

ACF Bonder & Bonding Equipment


Ultrasonic Bonder ACF laminator aligner ACF_bonder



These equipment are design to support ACF process / production requirements.

1) ACF Tape Attached Equipment

2) IC Alignment System

3) FPC/ TCP Alignment System

4) IC/ TAB / TCP Chip Bonding System

5) LCD Panel Inspection System

6) Ultrasonic Bonder

To meet your budget, we offer both the Manual and Semiautomatic Systems. Please enquire for more details.

Contact us